Ball Grid Array (BGA) spheres or balls available in leaded and lead-free alloys. See our Solder Alloys page.

IPS Solder Powder & BAG Spheres

Lead Free BGA Sphere
Alloy Composition	Melting Point (°C)	Gravity	Strength (kgf/mm)	Elongation (%)
Sn/Ag3.5 *Sn/Ag3.0/Cu0.5 *Sn/Ag3.5/Cu0.7 *Sn/Ag3.9/Cu0.6 *Sn/Ag3.8/Cu0.7 *Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01  Sn/Ag3.0 *Sn/Ag4.0/Cu0.5	221 217-219 217-219 217-219 217-219 217-219 217-219 217-219	7.36 7.40 7.42 7.42 7.42 7.40 7.34 7.42	4.18 5.30 5.34 5.34 5.34 5.40 6.60 5.34	58 47 48 48 48 48 27 48

* Fuji Electronic Holdings Co Ltd. Patent number as follows:
Japan No. 3296289, U.S. No. 6179935B1, Germany No. 19816671C2 (add content of percentage of Ni and Ge)

Flux Gel

A range of flux gel for BGA (Ball Grid Array) and rework applications. Also available for electrical, engineering and plumbing applications.

MOB 39 i

A gelatinous consistency flux, application specific for BGA (Ball Grid Array) components but offering benefit in rework applications where sufficient solder is already present on the component.
Spread thinly at approximately 3 µm thick it will effectively flux any tinned surface without the problem of droplet volume control with the added advantage of leaving a minimal non-corrosive residue.

MOB 39 i: Supplied in syringes of 5g and 10g.

MBO Blu Gel: A general purpose flux gel.

Alugel MSDS: Flux Gel suitable for soldering aluminium and aluminium alloys.
Alugel TDS

Technical Data Sheet for each product is available. Click on the PDF icon to view it.